Internal and effective stresses in nanocrystalline electrodeposited Ni

Stresses in nanocrystalline materials

Thin film Ni-Cu diffusion couples (individual layer thicknesses: 50 nm) were prepared by direct-current magnetron sputtering on silicon substrates. Interdiffusion and solid-solution formation, the associated changes of microstructure and the evolution of mechanical stresses of the Ni-Cu diffusion couples during thermal treatments were investigated employing ex-situ X-ray diffraction phase and t...

Deformation of electrodeposited nanocrystalline nickel

The mechanisms of deformation and damage evolution in electrodeposited, fully dense, nanocrystalline Ni with an average grain size of ~30 nm and a narrow grain size distribution were investigated by recourse to (i) tensile tests performed in situ in the transmission electron microscope and (ii) microscopic observations made at high resolution following ex situ deformation induced by compression...

Nanoindentation and micro-mechanical fracture toughness of electrodeposited nanocrystalline Ni–W alloy films

Wear behavior of carbon steel electrodeposited by nanocrystalline Ni–W coating

Ni-W coatings, compared to pure nanocrystalline Ni, exhibit higher hardness and wear resistance. In some cases, these coatings are considered as environmental friendly alternatives for hard chromium coating. Till now, most of Ni-W coatings have been produced by direct current electrodeposition from alkaline baths. In this study square pulse current was used for deposition of Ni-W precipitates f...

The Mechanical and Electrochemical Properties of DC-Electrodeposited Ni-Mn Alloy Coating with Low Internal Stress

The nickel-manganese (Ni-Mn) alloy coating prepared from DC electrodeposition process in sulphamate bath was studied. The effects of process parameters, such as current density and electrolyte composition, on the cathodic current efficiency, microstructure, internal stress and mechanical properties were investigated. Because of its crucial effect on the application to the electroforming of micr...